Novellus acquired Gasonics in 2001. Novellus now offers a suite of advanced photoresist strip and clean products. 

AURA 1000 is an advanced dry chemistry processing systems for photoresist removal.

LAM RESEARCH / NOVELLUS / GASONICS 

A1000 

The L3510 is an enhancement to the L3500.

L3510

A2000

The GAMMA 2130 system is a front-end-of-line (FEOL) photoresist strip system for 300mm wafers. Our multi-station sequential processing architecture incorporates six stations within a single process chamber, enabling a 30 percent higher throughput rate when compared to that of the closest competitor.

GAMMA 2130

The GAMMA 2100 200mm photoresist removal system uses a plasma source to strip photoresist. The GAMMA architecture features a multi-station sequential processing design with six strip stations, resulting in high wafer throughput with a minimal number of critical subsystems.

GAMMA 2100

The GAMMA Express, introduced in 2006, is a high productivity resist strip system designed to meet the technology requirements for 45 nanometer manufacturing. GAMMA Express performs high dose implant strip (HDIS) and incorporates non-oxidizing processes for advanced silicides and low-k dielectric films. The redesigned GAMMA Express platform offers a new direct-drive wafer handling subsystem, as well as a new high ash rate source.

GAMMA EXPRESS

STRATA

Gasonics/IPC: Aura 3000, downstream rrucrowave asher, 60 wafers per hour, 8-inch capable.

A3000

PEP 4800DL

The Aura 3010 is an enhancement to the Aura 3000.

A3010

GASONICS / NOVELLUS PEP 3510A/A is a Etchers & Ashers system. The PEP 3510A/A has can product a wafer size of 8”. For Standard Mechanical InterFace (SMIF) customers, the option of a SMIF-ARM provides an extra throughput advantage, The results of these improvements are higher resist removal rates, faster wafer handling and improved cost of consumables (CoC), which translate to lower cost per wafer processing for customers.

The GaSonics PEP 3510A is a versatile microwave downstream photoresist removal system, designed for clean, damage-free removal of photoresist. PEP 3510A utilizes a combination of platen and lamp wafer heating resulting in excellent removal rates and uniformity. This system excels in bulk photoresist removal, and descum applications.



PEP 3510 A/A

9104

PEP 3510

L3300

7100

The G400 and GxT are based on the production-proven, market-leading GAMMA platform. Targeted for bulk strip and high-dose implant strip (HDIS) applications, the G400 is the industry’s most productive ashing system, with throughputs of over 400 wafers-per-hour. 

GAMMA G400

PEP 3510 Plus is a versatile downstream microwave photoresist removal system designed for the clean, damage-free removal of photoresist materials. One of the most dependable bulk strip systems on the market, the PEP 3510 routinely delivers 300 hours MTBF with 95% uptime. More than 300 PEP-based systems have been installed in fabs around the world.

PEP 3510plus

The G3D is a version of the GxT platform designed for advanced wafer-level packaging applications, including contact clean and TSV photoresist strip.

L3500

L3200

PEP IRIDIA DL

The PEP IRIDIA is an advanced cleaning system designed for sub-0.18-micron 200mm wafer applications. The IRIDIA’s modular architecture allows manufacturers to configure the system for both front and back-end-of-line cleaning applications down to 90 nanometer device geometries. Targeted at critical steps in copper and low-k manufacturing processes, the IRIDIA offers the highest productivity of any 200mm dry-clean system currently on the market.

PEP IRIDIA

GAMMA xPR

AE-2001

The G400 and GxT are based on the production-proven, market-leading GAMMA platform. Targeted for bulk strip and high-dose implant strip (HDIS) applications, the GxT, is designed for critical logic device manufacturing process steps that demand low silicon loss and ultra-low defectivity.

GAMMA GxT

L2200

The SIERRA system is an advanced dry-clean system for 300mm wafer manufacturing processes. It delivers photoresist and residue removal for today’s most advanced applications. The SIERRA system is designed specifically to address the intricate cleaning challenges associated with the industry’s migration to copper metallization and low-k dielectrics. It yields significantly higher capital productivity and significantly lower cost-of-ownership advantages than competing dry-clean systems.

SIERRA

The PEP 3010A is compatible with both 150 and 200 mm wafers and is available with both Standard Mechanical InterFace (SMIF) and Automatic Guide Vehicle (AGV) options.

PEP 3010A

GASONICS / NOVELLUS PEP 3510A is a Etchers & Ashers system. The PEP 3510A has a wafer size of 8". Key features of the 3010A include lamp-based chamber heating, which enables rapid changes in chamber temperature, and closed-loop temperature control for precise monitoring of wafer temperature during processing. User friendly graphical user interface, which facilitates the tracking of wafer statistics.

PEP 3510A

Microwave downstream photoresist removal system, designed for clean, damage-free removal of photoresist

LAM RESEARCH / NOVELLUS / GASONICS

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