Hitachi High-Tech offers a range of advanced industrial equipment solutions for assembly and processing machines used in the production of lithium batteries, auto parts and advanced film. Also offered R&D equipment necessary for the development of FC, organic materials, and catalyst materials.

HITACHI

DM 421P

M 216AE

M-206A

M-308AT

UA-3150A

M 712

UV/ozone asher, batch, 30 wafers per pass (2 chambers), 55 wafers per hour, 8-inch capable

UA-5200A

M-8190XT

M-308NX

M-308ATE	

U-702

UA-7200

M-712E

M-308FX

SPC-500B

 M 602A

M-511AE

M 602

M 531A

HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.



HS-9050

M-511A

M-318EX

U-511A

Hitachi: M-308AT/ATW ECR metal etch, clustered etch, stirip, wet rinse stations.

M-308ATW

M-4510XT

M 612

U-722

M-328FX

M501AW	

M-3Z8EX

M-712A

M-712XT

M 612A

E-541AW

DM 421

UA-3150B

U 7050A

M511

M-216NX

M 501

DM 471

UA-5200

U-8250

M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond.

 M-8000

M-8170XT Sebit is the upgraded version of the M-8170 that was launched in 2007. In addition to the microwave ECR approach, the new model introduces high-speed wafer temperature control, high vacuum exhaust control technology, and a symmetrical chamber structure. The new system achieves superior profile controllability, CD uniformity, and edge exclusion performance for hard mask etching and double patterning-compatible mask etching. The system also handles high-k dielectric gate insulation film, metal gates and a variety of other new materials. Major semiconductor memory manufacturers have already completed their evaluation for the 20nm generation of the system, and are looking to incorporate it into their mass production lines going forward.

M-8170XT

M-8170

U-712AE

M-6000

M-308FXW

M-600

U-712A

E-642A

M-9000

Its integrated metal etch/photoresist strip/wet clean capability is highly effective in preventing corrosion, a serious problem in advanced metallization systems.

M-308ATWE

HITACHI

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トップHITACHI Etchers & Ashers

DM 421P

6 掲載リスト

M 216AE

5 掲載リスト

UA-3150A

4 掲載リスト

M-308AT

4 掲載リスト

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