Lam Research Corporation acquired SEZ Group, the leading supplier of single-wafer clean technology and products to the global semiconductor manufacturing industry.

LAM RESEARCH / SEZ

DV-38

The Spin-Processor 102 adapts SEZ s proven state-of-the-art 200 and 300 mm equipment design for 4, 5 and 6 inch wafer diameters.

SP102

SP200

SP303

RST 203

SP4200

SP203L

RST-100

The SEZ SP 323 is a Etchers & Ashers system. The SP 323 can produce wafer size of 12”.

SP323

DV-34

The SEZ SP 203 platform serves a wafer size 8”. The SEZ SP 203 has a spin processor and standard wafer handling.  

SP203

Single Wafer Processing for Backside Etch


RST-201

RST 101

SP4300

Based on Lam’s pioneering single-wafer spin technology, the DV-Prime® and Da Vinci® products provide the process flexibility needed with high productivity to address a wide range of wafer cleaning steps throughout the manufacturing process flow. For some applications, select models are also available through our Reliant® Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.

DV-PRIME

The SEZ 304 platform serves a variety of wafer cleaning and thinning applications. The SEZ 304 is used in 300mm fab. Applications for the SEZ 304 include backside film removal prior to advanced lithography operations and silicon stress relief for die strength enhancement in thinning operations.

SP304

SP201

SP305

1200

The first product in the Da Vinci series, the eight-chamber DV-38F, specifically targets back-end-of-line processing of 300-mm diameter wafers characterized using 90-nanometer manufacturing process technology and smaller geometries. 

DV38F

This single-wafer processor boasts cost efficient wet/ clean etch solutions for advanced wafer level packaging (WLP). WLP manufacturing applications include: underbump metallization etch, silicon substrate thinning/stress relief, photoresist removal, and post deflux cleaning. SEZ SP 223 machine applications include wafer stress relief as well as WLP substrate thinning. Its wet/ clean processes eliminate residue from multiple surfaces including bumps, bond pads, and high-aspect ratio (HAR) through-silicon vias (TSVs). Safety features include earthquake protection, leak detection, drip pan for the main unit, and lightweight tower design.

LAM RESEARCH / SEZ

概要（Overview）

現在の掲載品

全ての製品

サービス

トップLAM RESEARCH / SEZ Etchers & Ashers

SP4200

0 掲載リスト

RST 203

0 掲載リスト

SP303

0 掲載リスト

SP203L

0 掲載リスト

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

すべてのLAM RESEARCH / SEZ Etchers & Ashers