説明
ALD (Atomic Layer Deposition)構成
構成なしOEMモデルの説明
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
NT333
検証済み
カテゴリ
ALD
最終検証： 20日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106449
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
NT333
カテゴリ
ALD
最終検証： 20日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106449
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ALD (Atomic Layer Deposition)構成
構成なしOEMモデルの説明
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.ドキュメント
ドキュメントなし