ADVANCED ENGINEERING

MWM-850

The AWC-650 Automatic Wafer Cleaner System leads the way in post-dicing wafer cleaning. Highly efficient and versatile in the removal of sub-micron particles from all sawed and scribed substrates, the AWC-650 is a robust and flexible system. This PLC controlled system provides effective and repeatable cleaning for worry-free processing of singulated substrates. Process parameters are easily modified and stored for building a process recipe library stored in the system memory.

AWC-650

Mounts wafers/substrates on dicing frames up to 12", simple-to-use, adjustable temperature, roller mechanism,
UV tape capable.

MWM-853

UV-951

Fully automatic single cassette operation, up to 12" (300mm), with auto-handling, individual lamp sensors, automatic irradiation dosage control, UV status indicator, UV intensity monitoring, cassette status indicator.

ADVANCED ENGINEERING

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MWM-850

AWC-650

MWM-853

UV-951

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