ASC International helps electronics manufacturers worldwide improve production yields and profits through the utilization of our industry leading portfolio of 3D Solder Paste Inspection systems, 2D-3D Automated Optical Inspection systems, Digital Video Inspection systems and 3D Metrology systems.

VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International's VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18" x 22" (450 mm x 550 mm). APXT automates the 3D solder paste measuring process and provides the accuracy and repeatability Electronic Manufacturers have come to expect from ASC International.

ASC INTERNATIONAL	

VisionPRO AP-XT

The MSS 130 Digital Video Inspection Scope includes plug-and-play to any computer system, a multiple Image tool for image enhancement and clarity, and a measurement tool for shapes such as line, circle, angle, center point, and arc. It works with a variety of lenses and lighting which are fully controllable. It can also be networked with multiple digital scopes.

MSS 130

The VM450 is the latest development in True 3D measurement technology. Integration of a color camera with a larger Field of View (FOV), while still retaining .07 mil resolution,
allows operators to measure everything from 0201’s and micro-BGA’s to your largest applications. With its Windows® XP interface, the VM450 is easy to learn and use, making it
an exceptional value for the SMT manufacturer concerned with improving printing and production yields.

VM450

The VisionMaster 150 system is sophisticated, 3-dimensional technology coupled with an intuitive Windows® XP interface and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGA’s and many other PCB features. The completely automatic measurement process eliminates operator errors and offers excellent measurement repeatability. This makes the VisionMaster an exceptional value for the electronics manufacturer concerned with improving production yields. 

VisionMaster 150

VisionMaster AP450 incorporates high resolution PCB positioning with sophisticated, high speed 3-dimensional measurement technology found in ASC Internationals’ popular VisionMaster450 to provide electronics manufacturers’ with the most automatic and accurate 3-D solder paste measurement tool in its class. The AP450 eliminates operator handling problems associated with other off-line measurement and inspection systems, improving repeatability and reproducibility. This makes the AP450 an exceptional value for the electronics manufacturer concerned with improving production yields.

VisionMaster AP450

The LineMaster Falcon Plus AOI solution offered by ASC International provides manufactures with a solid inline platform to validate the overall variables associated with component placement. State of the art Detech2 Technology software detects attributes such as absence - presence, polarity, OCR, solder inspection and lead quality can all with very low false call rates. The Falcon Plus provides a value proposition unmatched in the industry.

LineMaster FALCON Plus

AV 862 series has been enhanced with image based and algorithm analysis for more precise inspection. Improved structure and hardware for operation stability, speed, user friendly, quality control and productivity. AV 862M is a standard specification.

AV862M

The VisionPro Merlin AOI solution offered by ASC International provides manufactures with a solid platform to validate the overall variables associated with component placement. State of the art Detech2 Technology software detects attributes such as absence - presence, polarity, OCR, solder inspection and lead quality can all with very low false call rates. The Merlin provides a value proposition unmatched in the industry.

VisionPro MERLIN

LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution.

LineMaster FUSION

AV 862 series has been enhanced with image based and algorithm analysis for more precise inspection. Improved structure and hardware for operation stability, speed, user friendly, quality control and productivity. AV 862L is a large specification.

AV862L

LineMaster Fusion 3D provides high speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. LineMaster's completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.

LineMaster FUSION 3D

The VisionPro M300 and M500 employ sophisticated 3-dimensional technology combined with an intuitive Windows OS interface, and packaged in rugged, bench-top hardware designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. The completely automatic measurement process eliminates operator errors and offers excellent measurement repeatability. This makes the M300/M500 powerful yet cost efficient tools for the electronics manufacturer concerned with improving production yields.

VisionPro M300

The VisionPro SP3D combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of SMT stencil printing process. With its Windows® OS and service free USB interface, the SP3D is easy to learn and operate, making it the most cost effective SPI solution for the SMT manufacturer concerned with improving printing quality and production yields.

VisionPro SP3D

LaserVision SP3D Mini provides a powerful alternative to visual inspection of solder paste deposits, automatically calculating and storing critical printing characteristics in one click. Using a lower cost microscope platform, LaserVision SP3D Mini enables ASC International to offer the same remarkable SPI technology found in their VisionPro and VisionPro AP Series models, but in an entry-level instrument. This makes LaserVision SP3D Mini ideal for manufacturers striving for better process control of the paste printing process, but working with a limited budget.

LaserVision SP3D Mini

VisionPro VM150

VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

VisionPro AP500

The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® 10 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Offering a larger FOV sensor for better coverage and real-time, integrated SPC run charts and data reports, the VisionPro M500 provides exceptional value for the electronics manufacturer concerned with improving production yields.

VisionPro M500

VisionPro HSi continues ASC International’s quest to providing the next generation of advanced 3D SPI tools for the ever increasing demands within the surface mount technology industry. The HSi takes stand alone SPI to a new level with its unmatched high resolution, high speed 3D sensor technology. Intuitive user interface, 5 minute Gerber/CAD import programming and integrated SPC analytics makes the HSi an exceptional value for the electronics manufacturer concerned with improving production yields hindered by poor overall quality of their print process.

VisionPro HSi

VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. VisionPro's completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

ASC INTERNATIONAL

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