Axcelis acquired Fusion Systems Corporation in August 1997.
Fusion is a leading worldwide supplier of single-wafer ashers and photostabilizers used in the fabrication of advanced semi- conductor devices.

AXCELIS / FUSION

200 ACU 

INTEGRA

300mm photoresist strip system for front-end of line strip applications.

RAPIDSTRIP 320

The FusionES3 is a 300mm plasma asher with dry strip capabilities, designed for post-implant and post-etch process steps. It has a flexible process architecture, making it suitable for conventional and dual damascene process flows. It provides dry resist and residue removal, and its elevated ash rate delivers high throughput and productivity. The tool is designed to run oxidizing, fluorinated, and reducing chemistries. Its unique dual-chamber platform enables dry strip and residue removal to be performed within a single chamber, increasing productivity and reducing the system footprint.

FUSION ES3

200 MCU

The FUSION M150PC, manufactured by AXCELIS, is a photostabilizer system used in the semiconductor industry. It is designed to work with 6-inch wafer sizes. The system belongs to the Microlite 150 series and is known for its ability to provide a clean and efficient one-step process for hardening photoresists. It offers high production throughputs, making it suitable for semiconductor manufacturing applications where photoresist hardening is required

M150PC

RAPIDCURE 320FC

The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.

200 PCU

The FusionPS3 is a 300mm photostabilization system designed for photoresist curing, low-k curing, and non-volatile memory charge erasure. It supports the integration of advanced materials into mainstream device production and maximizes intermolecular reactions to deliver consistent and stable resist characteristics. The FusionPS3 incorporates leading-edge photoresist curing capabilities in a unique, dual-chamber platform, enabling simultaneous processing of different recipes. It guarantees maximum machine uptime, high productivity, and lower cost of ownership, meeting the stringent requirements of 300mm production capability.

FUSION PS3

MICROLITE

The Fusion m200pcu is a Photostabilizer System made by Fusion Systems. It utilizes the standard dual unicassette wafer handling platform. The Fusion m200pcu is a single chamber DUV Photostabilizer with a wafer size of 8" or 6". It has shielded SECS cables and is used for UV Bake process applications. The irradiator contains an Hg High Intensity Lamp and 2.45 GHz magnetrons.

M200PCU

RAPIDSTRIP 210

The platform is ideally suited to the demands of high-volume memory manufacturing, where the need for tool reliability and versatility is at a premium. Axcelis designed the RadiantStrip 320 for dependability and productivity in high-volume, low cost-of-ownership manufacturing environments. The machine offers a modular and scalable platform for bulk photoresist strip, advanced polymer removal and complete dry clean processes in the same chamber.

RADIANTSTRIP 320

The Fusion M200PC is a photostabilizer used in the semiconductor industry. It uses a special process to harden and impact high-temperature stability to photoresist materials on semiconductor wafers. Photostabilized wafers are capable of withstanding high temperature hard baking.

M200PC

M150PCU

The FusionGemini Plasma Asher ES (Enhanced Strip) is a device designed for advanced IC manufacturing. It eliminates the need for “wet” chemical processing to remove post-strip residues, providing a “dry” solution through the use of specialized gas chemistries. This results in dry strip processes that only require a follow-on DI water rinse. The FusionGemini ES can perform resist strip and residue removal in the same chamber, providing high throughput and rapid parallel processing. It also provides the lowest damage of any residue removal-capable plasma asher in the industry, and uses radiant heating for multi-temperature stripping. The FusionGemini ES uses O2, H2:N2, CF4, and custom gases, and is a 200mm photoresist strip system.

GEMINI ES

The Fusion M150 is a photoresist stabilization tool used for deep UV flood exposure and features a 150mm heated/water cooled wafer chuck.

M150

M200 ACU

GEMINI GPL

200mm photostabilization system for photoresist curing.

GEMINI PS

The new FusionES3i system supports nearly all dry-strip requirements for copper, low-k dielectric, deep trench and vias, and other applications in a single tool.
Second generation 300mm photoresist strip system.

FUSION ES3i

Second generation 200mm photoresist strip system for back-end of line stripping of photo resist.

RADIANTSTRIP 220

The Fusion Gemini PCU is a photostabilizer used for advanced device manufacturing. It preserves CDs and boosts the performance of etch and implant processes.

GEMINI  PCU

The FUSION GEMINI GPL MCU202 is a plasma asher used in semiconductor manufacturing processes. Its compact footprint measures approximately 1.14 meters x 1.6 meters (3.75 feet x 5.3 feet). The primary application for this system is bulk strip, which involves removing material layers from the surface of semiconductor wafers. The asher utilizes a downstream microwave plasma as the process source, allowing for efficient and controlled material removal during the strip process. 

GEMINI GPL MCU202

GEMINI GES

200PCU POLO

150PC

ES3Lk is Axcelis Technologies' 300mm resist stripping system specifically designed to support the integration of low-k dielectric materials.

FUSION ES3Lk

200mm photoresist strip system for front-end of line strip applications.

RAPIDSTRIP 220

M200PCUPOLO

GEMINI 2

The Fusion Gemini GPS is a UV Cure System made by Axcelis / Fusion. It has two 8" open cassette stations and a process chamber mWave PS: HV-SMPS. The system software (OS) is WinNT 4.0 SP 6 and the system software (App) is version 3.43.

AXCELIS / FUSION

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