Datacon Technology is a manufacturer of flip chip bonding, multichip die bonding and other related assembly equipment.

The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications.

FlipChip Bonder

BESI / DATACON

8800 TC advanced

The Datacon 8800 TC is a bonding equipment that utilizes Thermo Compression (TC) technology, which is a crucial technology for current 2.5D/3D chip-to-substrate (C2S) and chip-to-wafer (C2W) packaging applications. Thermo Compression with CUF (Chip-to-Uneven-Flag) is a well-established process used in 3D memory applications.

Die Bonder


8800 TC

The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

2200 EVO hS

The PPS 2200 series die bonder offers totally modular hardware and software for multichip applications. Four types of nodes are capable of managing pneumatic cylinders, DC motors, step motors, and even the proprietary image processing system.

PPS 2200

Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield.
- Versatile High Speed Flip Chip Bonder
- Unique Quattro Concept
- Accuracy ± 4μm @ 3σ
- UPH up to 16,000

8800 FC QUANTUM hs

8800 FC QUANTUM sigma

The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi. With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements. While significantly increasing the accuracy and placement capabilities the Datacon 2200 evo advanced does not forget its roots in the Multi Module Attach family. It is still offering the unbeaten flexibility as well as the full customization capability that the Datacon 2200 evo platform is so well known for.

2200 EVO advanced

8800 FC QUANTUM plus

8800 FC QUANTUM advanced

The Datacon PPS 2210 is a multi-chip die bonder used for attaching chips to a substrate.

PPS 2210

PPS 2211

The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing. 

2200 EVO

The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.

2200 APM

The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging.

The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers.

Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.

2200 APM+

CS 1250

The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.

2200 EVO plus

The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).

8800 CHAMEO

The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. 

FlipChip Bonder

8800 FC QUANTUM

FITO F-3100

As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.
The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs

FlipChip Bonder

8800 CHAMEO advanced

The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

BESI / DATACON

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