Kulicke & Soffa is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™.
The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds.
Bond Force Control System with Piezo Sensor Technology
Advanced Low Friction Wire Feed System
Fully Programmable BITS System
Latest PC-based Processing Power
Small Ball Detection
Maxµm ultra Enhanced Performance
UPH +10% over the Maxµm plus
±2.5µm Accuracy for 35µm Pitch Production
Copper Wire Bonding Capable

KULICKE & SOFFA (K&S)

Maxµm Ultra

The ps(Power Series) IConnPS ball bonder, which replaced the Maxum Ultra ball bonder and improves IC inter-connect performance with expanded technology that addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

IConn

The industry-leading performance of the award-winning Maxµm™ high speed ball bonder is taken to an even higher level with the introduction of the new Maxµmplus. Users who want greater throughput and finer pitch capability can expect:
 UPH 10% greater than the Maxµm on most applications
 + 2.5 µm accuracy at 3 sigma
 35 µm ultra-fine-pitch process capability
This yield-enhancing accessory consists of the following...
 Innovative Moving EFO Wand Technology
 Electronic Flame-Off from directly below the wire axis
 Specially designed, Fine-tipped EFO Wand and 8X Mag Optics
...resulting in these benefits:
 Improved Free Air Ball and Bonded Ball Concentricity
 Reduced "Small Ball" occurrence
 Better intermetalic coverage and higher bond strength
 Greater yield for ultra-fine-pitch processes 
A reduced-friction wire feed path for wire down to 15 µm diameter and more efficient X-Y table motion help reduce wire cycle times to 63.0 msec. Advanced teaching and calibration software improve overall accuracy to ± 2.5 µm. This combination allows ultra-fine-pitch bonding of devices at speeds that are as much as 10% faster than the Maxµm — already the industry benchmark for accuracy and throughput.

Maxµm Plus

K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

RAPID

IConn MEM PLUS ELA

8060

Fully automatic wire bonder. 
± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kit

IConn PLUS

The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.

8028

The Maxum Elite to supersede the Nutek it provides approximately a 10% productivity improvement over its predecessor and offers various other performance improvements.

Maxµm Elite

4123

1488 PLUS

8028 PPS

 ConnX-LEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM bonding platform. With new features and enhancements specifically designed for LED applications, ConnX-LED will help K&S customers increase their efficiency and productivity, and meet the challenges of the fast-paced, high growth LED market.

ConnX-LED offers all of the features required for bonding LED packages, including accuracy to +/- 3.5 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others—providing customers with reduced cost of ownership in a highly competitive market space

ConnX LED

Advanced stack die and ball grid array applications.

iSTACK

ConnXPS ball bonder replaced our Maxum Elite ball bonder. The ConnXPS is engineered to provide optimal manufacturing capabilities for the lower pin count IC market and the rapidly growing LED market.

ConnX

MAXUM	

4124

4524

7100

Advanced copper wire applications demanding high productivity.

IConn ProCu

Model 1488 Turbo automatic gold ball wire bonder.

1488 TURBO

1471

4526

Automatic ball bonders which provide up to 20% more productivity than the Model 8028-PPS ball bonder and supports 45 micron production-level process capability.

Maxµm

8020

6495

6496

The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.

AT PREMIER

Advanced packaging, flip chip thermo-compression bonding applications.

APAMA C2S	

982-6

4524AD

Ball bonder, large area substrate and matrix applications for copper wire.

IConn ProCu PLUS LA

4522

The Model 9388 LaserPro uses a laser to reflow and attach solder balls after they are deposited on the work surface. The laser beam is directed from the laser unit via an optical fiber down through the capillary that places the solder balls. After a ball is placed on the work, the laser fires and reflows the solder, which attaches the solder ball.

9388 LaserPro

7500 PLUS

7500

1474fp

Ball bonder, high-end copper wire applications demanding advanced process capability and high productivity.

IConn ProCu PLUS

6497

4129

ULTRALUX AUTOMATIC WIRE BONDER is the latest generation ball bonder utilizing  the latest technologies and materials that will save LED manufacturers up to 10% capital cost. 

ULTRALUX

8098

4523

1470-4

4700

7100 AD

1478

Wedge bonder, power hybrid and automotive modules with extended area using heavy and thin aluminum.

ASTERION 

FIRST K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications

RAPID Pro

HYBRID 3

Model 7500 automatic dicing saw. This saw is developed product providing improved accuracy and reliability.

Wedge bonder, extended area for battery bonding and dual lane hybrid module bonding.

ASTERION EV

984-6

**PARTS**

4523AD

982-10 PLUS

1419

7300 csp

The Model 1472 automatic aluminum wedge bonder and a series of manual ball and wedge bonders.

1472

The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in  chip-on-board  (COB),  multi-chip modules  (MCMs) and similar  devices.

8090

IConnPS PLUSTM LA (Large Area) is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.

The IConn PLUS LA (Large Area) is designed to meet all leading edge wire bonding challenges. It has an extended bondable area to 87 mm, which is becoming an industry standard strip format.

IConn LA

1484

984-10

1488L TURBO

1470

8098 PPS

ConnX LED PLUS

XENON

Advanced packaging, thermo-compression for chip-to-wafer, high accuracy flip chip ("HA FC") and high density fan-out wafer level packaging ("HD FOWLP") bonding applications.

APAMA C2W

5408

IBOND 5000

Wafer level bumping for area array applications.

WaferPRO Plus

ADVANCED PACKAGING (FLIP-CHIP). HIGHEST ACCURACY, HIGHEST UPH FLIP-CHIP PERFORMANCE. Kulicke & Soffa's Katalyst delivers the industry's highest accuracy and speed for flip-chip placement.  Its hardware and technology enable < 3 μm accuracy on substrate or wafer, achieving the best Cost-of-Ownership in the industry. Best-in-industry flip-chip at 15K UPH Sprint with 3 μm accuracy. Ease-of-use Automated Recipe with fully guided Setup Wizards. Automated , UPH neutral Accuracy Calibration, to avoid nozzle-to-nozzle variations during runtime. Automated thermal Drift Compensation

KATALYST

SpeedTip

Advanced packaging, high performance and productivity die attach bonder for single or stack die bonding.

APAMA DA

Wedge bonder, power semiconductors using either aluminum wire or PowerRibbon

PowerFusion TL

K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

RAPID MEM

Ball bonder, cost performance extended large area substrate and matrix applications.

ConnX PLUS ELA

The Models 1484XQ and 1484LXQ automatic gold ball wire bonders.

1484XQ

982-6 PLUS

UV-950

ConnX ELITE Opto LA

Automatic wire bonder designed for low lead applications, a segment of the market we had not previously targeted.

Nu-Tek

8068

Ball bonder, extended large area substrate and matrix applications for copper wire.

IConn ProCu PLUS ELA

HIGH PERFORMANCE & HIGH PRODUCTIVITY DIE ATTACH. The iStack S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond force detection mechanism, delivering productivity improvement and performance.

iSTACK S+

Chip and IC shooting from 0402M (01005) to 17.5 x 17.5 x 15 mm at 51,000 cph (IPC9850(A))

iFlex T4

End-of-line placer placing up to 120 x 52 x 25 mm at 7,500 cph (IPC9850(A))

iFlex H1

ELITE

8028L PPS

ConnX VLED

ConnX LA

1484XQ PLUS

TAB is an alternate assembly method which uses a  thin, flexible film of laminated copper and polyamide in place of a conventional package.  In a TAB assembled device, the die is bonded directly to copper leads, thereby eliminating the need for wire bonding.  The Company's principal TAB bonder is the Model SP2100.

SP2100

PowerFusion HLx can handle extra-wide matrix and IPM leadframes up to 105 mm wide. The HLx Model has all the capabilities of the HL Model with the added benefit of handling leadframes up to 105 mm wide. Whether you have a current requirement for wide leadframe processing or just want to invest in a flexible platform for future leadframe development, the HLx Model is the best choice for many applications.

KULICKE & SOFFA (K&S)

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