PANASONIC

NPM-D3

NPM-W2.  Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.

NPM-W2

CM-602L, a highly versatile and efficient pick-and-place machine that revolutionizes electronics assembly. With abundant variations to choose from, tailor the machine to your specific product and production volume, accommodating everything from small chips to odd-shaped parts. The high-speed 12-nozzle head expands the parts range by an impressive 2.4 times, enabling lightning-fast placement of even □12 mm parts. Additionally, the general-purpose 8-nozzle head boasts enhanced abilities to handle odd-shaped components and supports 3D sensor integration and direct tray feeding. Experience improved area productivity with a downsized trolley and an optimized mounting sequence, boosting actual productivity by 8%. With high-speed detection using a 3D sensor and part thickness sensor, achieve top-notch quality during batch scanning of IC parts. The CM-602L's general-purpose transfer unit for POP and C4 mounting ensures accurate and efficient transfer of solder and flux. Enjoy seamless model switching and excellent compatibility with the CM402 series due to its innovative module design concept. Enhance your electronics manufacturing with the CM-602L, the epitome of precision, speed, and versatility.

CM602-L

CM602

DM60M-H

NPM-W

SMT process to accommodate more tray-supplied parts

NPM-TT2

NPM-D3A

CM402

For CM402-L, two PC boards can be clamped on one stage. (PC board length: 240 mm or less) When two PC boards are clamped, after the placement of the PC board on the downstream side is complete, that on the upstream side is carried out continuously. CM402-M/L has adopted the tape splicing feature, which allows supplying components while the placement machine is operating without stopping the placement operations. 
Model #: NM-EJM8A

CM402-L

Plasma Source: ICP Plasma
Process Gas: 2Lines (standard) *Maximum 6 Lines (e.g. Chlorinated Gas, Fluoride Gas, Ar, O2, He )
Applicable Wafer: ø100 mm wafer with orientation flat (standard) *Option : ø50 mm, ø75 mm, ø50 mm (with O.F.)
Wafer Material: Silicon (standard) *Option : Quartz, GaAs, Sapphire
Machine Dimensions / Weight*1: W 1170 mm × D 2650 mm, H 2100 mm / 1900 kg (Main body only)
Power Source*2: Single phase AC 200V, 6 kVA and Three-phase AC 200V, 15 kVA (Main body only)
Dry Air: 0.49 M Pa to 0.54 M Pa, 40 L / min [A.N.R.]
N 2Source: 0.5 M Pa to 0.7 M Pa, 50 L / min

E600L

CM101-D

SP70

NPM-D

FCB3

High Speed Screen Printer
• Fine printing 
• Easy operation 
• Main control boards are lead free 

SP60P-L

BM221

MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.

MD-P200

AM100

NM-SB50A

PANASERT-MV2FXL

PANASERT RHU

PANASERT RHU-LL

E725SC

FCX 501

RG131

HDP 3

PC30B-HS	

HDP-G1

RL132


The Panasonic HW27U-HF is a COB wire bonder optimized for expansive bonding areas, offering a rapid bonding speed of 0.15s/wire and a precise accuracy of ±5µm, ensuring flexibility and efficiency.

HW27U-HF

The Panasonic DT401 is a highly versatile and efficient pick and place machine that can handle a wide range of components. It has a placement accuracy of ±50 µm/Chip (Cpk1) for chips and ±35 µm/QFP (Cpk1) for trays. It can handle parts ranging from microchips to large parts such as BGAs, CSPs and connectors. The DT401 is designed to give users the flexibility to place a large number of varied, odd-shaped components at high speeds. It can handle a broad spectrum of components including 0402 chips, BGAs, CSPs, connectors and other large components up to 100 mm X 90 mm @ 25mm thickness.

DT401

SP28P-DH

MPAV2B

E 620i

SP60P-M

PSX303

PANASERT MV2C-A XL

SP60P-MU

FB50W-M	

NPM-TT

NPM-DX

HT122

BM231

E3000 metal etch (RIE), three chambers, etch, passivation, and dry strip.

E3000

NPM DSP

PSX303M	

PANASERT-RH3

E 626 I

MP-P200

PC32P-M

MPAV2-XL

MDP-300

MPAV2A NM-15A

HW22U-H

RL131

E600 RIE, poly, nitride, oxide, single-chamber system.

E600

HT132

DM21H-S

AVK3

KXFW1KS7A00

The Panasonic AV132 is a high-speed axial lead component insertion machine that features a compact design and dense supply unit configuration. It has a performance of 30,000 CPH and can insert components in four directions: 0°, 90°, 180°, and 270°. The AV132 is designed to handle both ammo pack and reel and has a placement accuracy of ±40µm/chip (Cpk≧1). The dense supply unit configuration is available in 40 or 80 component inputs with optional jumper wire.

AV132

CM212

AV131

MD-P200US

DMX401 Die Bonder, a cutting-edge semiconductor assembly tool engineered to elevate production efficiency and precision. With its multi-chip mounting function, the DMX401 enables seamless single-pass production of stacked dies and multi-chip packages, revolutionizing the packaging process. The bonding nozzle auto changer ensures swift transitions between bonding tasks, reducing downtime and maximizing output. Experience uninterrupted workflow with the automatic work pallet exchange during production, for a continuous and smooth work pallet supply

DMX401 

HDF NM-DC10

PANASERT RH6B

RHS2B

AVK2B

NPM-D2

KXFW1KS8A00

CM402A

PC30B-H

N610064416AA

HDF NM-DC15

PANASERT RH6

Interchangeable SMT placement machine brings flexibility to switch from ultra high-speed placement to multi-functionality on site. with its high speed head it can place up to 30,000 component per hour with a _+50 micron accuracy onto boards as large as 13" x 10". The multi-function head can place 8,750 cph with a _+35 micron accuracy. 

CM401

SP18

DM22M-H

KXFW1KS5A00

KXFW1KS6A00

PANASERT MV2VB

PANASERT RH2

HW27B-T

he RH5 radial lead component insertion machine from Panasonic utilizes a guide pin system and V-shaped cutting of the lead tips to deliver high-density insertion at 0.29 s/piece. For efficient production, the RH5 also features an auto-recovery function that automatically corrects insertion errors along with other programming functions.

PANASERT RH6S

PANASERT AV NM-2011B

RHU2

FCX501-L

PANASERT IPV

HDP V

HDP G3 NM-DB00A

PANASERT JVK NM-2037

SP28P-D	

FCX501-M	

The Panasonic UA3P profilometer series is designed to measure aspherical lenses & molds, semiconductor wafers, and any other precision component requiring nanometer level accuracy ranging up to 200mm x 200mm. 

UA3P-300

RHS2

PANASONIC

概要（Overview）

現在の掲載品

全ての製品

サービス

トップ製品

NPM-D3

NPM-W2

CM602-L

CM602

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

全ての製品

全ての掲載品を見る