2D/3D high speed scanner for large form factor packages

HEXA MAXX

TR 98

AT 368

2D/3D High Speed Scanner for Large Form Factor Packages



HEXA EVO

AT 28

HEXA WHIZZ

TR 48

TR 48 II	

AT 268

TR 48 III

HEXA SPRINT

PS300

iSORT Maxx

The iSort Express die sorting & taping system offers 3D bump inspection, Package Visual Inspection (PVI) and Active Die Inspection integrated into a class-leading die sorting platform.

iSORT EXPRESS

AT 468

DT 338

DURASORT

ISORT

HEXA EVO+

STI’s iFocus is a highly intelligent precision wafer inspection system that offers a comprehensive solution for the inspection of frame and/or whole wafer.

Using STI’s proprietary On-The-Fly (OTF™) vision, the iFocus can be configured to detect any type of micro defects arising from wafer processing, post dicing or packing.

The OTF™ optical system encompasses pioneering technology in areas such as optics and illumination design, 2D, 3D and active die inspection algorithms. Patented Simultaneous Dual Illumination Image Capture Technology is used to eliminate escape and reduce overkill without compromising throughput.

IFOCUS

STI

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HEXA MAXX

TR 98

AT 368

HEXA EVO

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