Ulvac: UNA 2200 asher, two-chamber, microwave downstream plus RIE, 50 wafers per hour, 8-inch capable.

ULVAC

UNA-2200

The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.

ULVAC

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UNA-2200

NA-8000

ENVIRO II

ENVIRO-1Xa

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