説明
Automated Debonding System構成
構成なしOEMモデルの説明
EVG850 DB Automated Debonding System Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.ドキュメント
ドキュメントなし
EVGroup (EVG)
EVG850 DB
検証済み
カテゴリ
Bonder/Debonder
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106473
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 DB
カテゴリ
Bonder/Debonder
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106473
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Automated Debonding System構成
構成なしOEMモデルの説明
EVG850 DB Automated Debonding System Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.ドキュメント
ドキュメントなし