We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 続きを読む
MCU 3000
カテゴリ
Bonder/Debonder概要（Overview）
MCU 3000 is used to temporary bond and de-bond the device wafer with our T-ESC´s. It is suited to low volume or R&D production, a trained operator can achieve between 15-25 bonds and de-bonds per hour.
現在の掲載品
0
サービス
検査、保証、鑑定、ロジスティクス
トップ掲載リスト
- 製品が見つかりません