The ESEC 2007 HS Plus is a die attacher manufactured by ESEC. Die attachers are used in the semiconductor industry to attach dies to substrates or lead frames. 

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

2007 HS plus

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