2100 FC hS
カテゴリ
Bonders概要（Overview）
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance
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