The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler. The Esec 2100 hS ix also incorporates the proven features of the 2100 i generation, such as the High Resolution Vision Systems and the Dual Dispensing Module. The Esec 2100 hS ix is the new generation High Speed Die Bonder providing now the best Cost of Ownership (CoO). 

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

2100 hS ix

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