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市場 > Bonders > BESI / DATACON > 8800 FC QUANTUM

8800 FC QUANTUM

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Bonders
概要(Overview)

The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability.

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