概要（Overview）

The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.