The EVG540 automated wafer bonding system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems.

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG540

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