EVG®540 Automated Chip-to-Wafer Bonding System
Single chamber production bonder up to 300 mm. Dedicated for chip-to-wafer and wafer-to-wafer bond processes. Unique compliant layer system to compensate chips thickness variations.

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG540 C2W

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