8090
カテゴリ
Bonders概要（Overview）
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
1
検査、保証、鑑定、ロジスティクス
