BA8
カテゴリ
Bonders概要（Overview）
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.
1
検査、保証、鑑定、ロジスティクス
