概要（Overview）

Stand-alone wafer cleaning unit, A-CS-1OOA will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality. ■ Maximum rotation speed of spinning table is up to 3,000 min-1 ■ Available frame size: 5 to 8" ■ Cleaning method: High-pressure Rinse Air dry (Driven by swing arm)