説明
説明なし構成
• Wafer Size (inches) : 8 • Install Type : Through-the-wall • Date of Manufacture: 06/28/99 • Software Version : MB60a1 • CPU Board Type : Pentium 3 400MHz or Higher : Yes • Electrical Requirements : 200/208VAC • Process Type: Polysilicon • Mainframe: Mirra Track o Dry In/Dry Out o Signal Lamp Tower o Integrated SMIF (qty 3 loaders) o Cassette Tank : Standard o Robot Type : 112” o Cleaner Type : Ontrak o Cleaner Chemicals Used : NH4OH o E-Chain Lifetime : Since installation o Cleaning Package : No o Spray Gun : Single o In-Situ Removal Rate Monitor : Motor Torque o Metrology Option : None o IPM : No • <b>Mirra Polish Heads</b> o Titan 1 Polish Heads o PPS Retaining Rings o Standard Wafer Loss Sensor • <b>Mirra Platens</b> o Teflon Coated Platens : No o Pad Type : IC 1000 o Pad Conditioner Head : P4 Intel o Pad Conditioner Disc : EWHA o Universal Disk Holder : No o Temperature Control : None • <b>Slurries</b> o Slurries/Platen Used : 1 o Chemicals Used : Oxide Slurry o Flow Rate : Standard o Dispense Arm : Standard o Slurry Flow Monitors : YesOEMモデルの説明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.ドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
MIRRA
検証済み
カテゴリ
CMP
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
14396
ウェーハサイズ:
8"/200mm
ヴィンテージ:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示APPLIED MATERIALS (AMAT)
MIRRA
検証済み
カテゴリ
CMP
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
14396
ウェーハサイズ:
8"/200mm
ヴィンテージ:
1999
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
• Wafer Size (inches) : 8 • Install Type : Through-the-wall • Date of Manufacture: 06/28/99 • Software Version : MB60a1 • CPU Board Type : Pentium 3 400MHz or Higher : Yes • Electrical Requirements : 200/208VAC • Process Type: Polysilicon • Mainframe: Mirra Track o Dry In/Dry Out o Signal Lamp Tower o Integrated SMIF (qty 3 loaders) o Cassette Tank : Standard o Robot Type : 112” o Cleaner Type : Ontrak o Cleaner Chemicals Used : NH4OH o E-Chain Lifetime : Since installation o Cleaning Package : No o Spray Gun : Single o In-Situ Removal Rate Monitor : Motor Torque o Metrology Option : None o IPM : No • <b>Mirra Polish Heads</b> o Titan 1 Polish Heads o PPS Retaining Rings o Standard Wafer Loss Sensor • <b>Mirra Platens</b> o Teflon Coated Platens : No o Pad Type : IC 1000 o Pad Conditioner Head : P4 Intel o Pad Conditioner Disc : EWHA o Universal Disk Holder : No o Temperature Control : None • <b>Slurries</b> o Slurries/Platen Used : 1 o Chemicals Used : Oxide Slurry o Flow Rate : Standard o Dispense Arm : Standard o Slurry Flow Monitors : YesOEMモデルの説明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.ドキュメント
ドキュメントなし