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説明
説明なし構成
CMP System, 4-Platten, w/ Entrepix/Ontrack ScrubberOEMモデルの説明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.ドキュメント
ドキュメントなし
カテゴリ
CMP
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120025
ウェーハサイズ：
不明
ヴィンテージ：
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT)
MIRRA
カテゴリ
CMP
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120025
ウェーハサイズ：
不明
ヴィンテージ：
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
CMP System, 4-Platten, w/ Entrepix/Ontrack ScrubberOEMモデルの説明
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.ドキュメント
ドキュメントなし