Mirra3400(Standalone CMP)
Equipment status: Working

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.

MIRRA

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APPLIED MATERIALS (AMAT)

MIRRA

CMP

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

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APPLIED MATERIALS (AMAT)

MIRRA