 Lam developed the Teres CMP integrated polishing and cleaning system based on a technological approach different from that of conventional polishers which utilize a rotating table and rotating polishing heads. Lam has developed a proprietary linear polishing method and has designed its polishing system to be installed in a Class 1 cleanroom environment to planarize patterned films on wafers, and to polish wafers at higher rates and achieve the uniformity and planarity that is necessary to manufacture advanced semiconductor devices.

LAM RESEARCH CORPORATION

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Lam is developing the Aurora CMP polishing system based on a technological approach different from that of conventional polishers which utilize a rotating table and rotating polishing heads. Lam has developed a proprietary linear polishing method and has designed its polishing system to be installed in a Class 1 clean room environment to planarize patterned films on wafers, and to polish wafers at higher rates and achieve the uniformity and planarity that is necessary to manufacture advanced semiconductor devices. When released, Aurora will possess unique advantages by being the Company's first fully integrated CMP polisher and cleaner system. Aurora is currently under development and is expected to be launched in early calendar 1998. 

LAM RESEARCH CORPORATION

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