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CENTURA SPRINT
カテゴリ
CVD概要（Overview）
Tungsten Deposition - Tungsten is the basic material used to connect the multiple layers of metal wiring on a chip. For many years, Applied has been a leading provider of systems to deposit tungsten and in fiscal 2000, Applied launched a new system, the Sprint™ Tungsten Centura, to fill the tight geometries required in sub-0.18 micron chip designs.
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