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説明
No missing parts構成
Single moduleOEMモデルの説明
The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.ドキュメント
ドキュメントなし
PREFERRED
SELLER
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
105396
ウェーハサイズ：
不明
ヴィンテージ：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PREFERRED
SELLER
BESI / DATACON
2200 APM
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 60日以上前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
105396
ウェーハサイズ：
不明
ヴィンテージ：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
No missing parts構成
Single moduleOEMモデルの説明
The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.ドキュメント
ドキュメントなし