FLIP CHIP BONDER-A110
概要(Overview)
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.
1
検査、保証、鑑定、ロジスティクス