MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.

Die Bonder

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MD-P200

DMX401 Die Bonder, a cutting-edge semiconductor assembly tool engineered to elevate production efficiency and precision. With its multi-chip mounting function, the DMX401 enables seamless single-pass production of stacked dies and multi-chip packages, revolutionizing the packaging process. The bonding nozzle auto changer ensures swift transitions between bonding tasks, reducing downtime and maximizing output. Experience uninterrupted workflow with the automatic work pallet exchange during production, for a continuous and smooth work pallet supply

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MD-P200

DMX401

MP-P200

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