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ASM AD898
    説明
    説明なし
    構成
    Die Attach
    OEMモデルの説明
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
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    ASM

    AD898

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    検証済み

    カテゴリ

    Die Sorters & Attachers
    最終検証: 30日以上前
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    67807


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明

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    Money Back Guarantee
    Available
    Transaction Insured by Moov
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    Refurbishment Services
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    同様のリスト
    すべて表示
    ASM AD898
    ASMAD898Die Sorters & Attachers
    ヴィンテージ: 0状態: 中古
    最終確認30日以上前

    ASM

    AD898

    verified-listing-icon

    検証済み

    カテゴリ

    Die Sorters & Attachers
    最終検証: 30日以上前
    listing-photo-593054df269f43839ae4a4bfcf91c91d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/593054df269f43839ae4a4bfcf91c91d/feae2ba5f07b47b5aa83c54658c8255c_952be52bcf704e67b72195d0f57e3a821201a_mw.jpeg
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    67807


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    Die Attach
    OEMモデルの説明
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachersヴィンテージ: 0状態: 中古最終検証: 30日以上前
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachersヴィンテージ: 0状態: 中古最終検証: 60日以上前
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachersヴィンテージ: 0状態: 中古最終検証: 60日以上前