メインコンテンツにスキップ

DDS2300

概要(Overview)

2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.

現在の掲載品

1

サービス

検査、保証、鑑定、ロジスティクス

トップ掲載リスト

このような製品をお持ちですか?
Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。