説明
説明なし構成
1) Power consumption : 5.0KVA 2) Input Voltage: 230V, 1 phase, ~ 50 / 60 Hz 3) Air Pressure: 6 Bar 4) Footprint: 1.95 m3 (1.65m W x 1.16m D) 5) Dry weight : 1,451Kg 6) Throughput: 16,000Device per hour 7) Wafer Size: 0.5mmx0.5mm to 12.5mmx12.5mm high aspect ratio die up to 10:1 8) Placement accuracy: Repeatability of +/-25µm(.001”) 9) Placement into pocket only 35 µm(.0015”) larger than the die 10) Bump inspection: 2D size +/-20% of nominal 11) Edge chip inspection: Detect edge chips from 15µm to 100µm 12) Post inspection: Tape seal integrity Die orientation, tombstone or tilted 13) Up-time, robustness: MTBF=500 hours, MTTR=30minutes, MTBA=2 hours, MTTA=3minutesOEMモデルの説明
Sort to Tape Reel at up to 16,500 UPHドキュメント
ドキュメントなし
BESI / DATACON
CS 1250
検証済み
カテゴリ
Die Sorters & Attachers
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
13921
ウェーハサイズ:
不明
ヴィンテージ:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示BESI / DATACON
CS 1250
検証済み
カテゴリ
Die Sorters & Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
13921
ウェーハサイズ:
不明
ヴィンテージ:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
1) Power consumption : 5.0KVA 2) Input Voltage: 230V, 1 phase, ~ 50 / 60 Hz 3) Air Pressure: 6 Bar 4) Footprint: 1.95 m3 (1.65m W x 1.16m D) 5) Dry weight : 1,451Kg 6) Throughput: 16,000Device per hour 7) Wafer Size: 0.5mmx0.5mm to 12.5mmx12.5mm high aspect ratio die up to 10:1 8) Placement accuracy: Repeatability of +/-25µm(.001”) 9) Placement into pocket only 35 µm(.0015”) larger than the die 10) Bump inspection: 2D size +/-20% of nominal 11) Edge chip inspection: Detect edge chips from 15µm to 100µm 12) Post inspection: Tape seal integrity Die orientation, tombstone or tilted 13) Up-time, robustness: MTBF=500 hours, MTTR=30minutes, MTBA=2 hours, MTTA=3minutesOEMモデルの説明
Sort to Tape Reel at up to 16,500 UPHドキュメント
ドキュメントなし