DISCO develops, manufactures, and sells precision machines and precision processing tools.

2008
Developed the "DDS2300" fully automatic die separator.

Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.

DISCO

DDS2300

Die separator for small-die wafers
Φ300 mm
SDBG
SDTT


DDS2310

Developed 2019
Die separator: Equipment used to singulate die from workpieces attached to dicing tape. First, die attach film, which is used to mount and laminate thin die, or a wafer with an internal SD layer formed after laser stealth dicing is attached to the tape. Then, the die are singulated by expanding the tape.

DDS2320

Reliable separation of small die wafers
The DDS2010 offers an integrated expansion and breaking solution to achieve high-yield and high-throughput die singulation of wafers processed using Stealth Dicing™ process (SD)※.

*Stealth Dicing™ is a processing method that focuses a laser within the workpiece to form a modified layer, after which a tape expander is used to separate the die. This processing method is effective in achieving street reduction for small die or rectangular-shaped die such as RFID ICs and line sensors.

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DDS2300

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