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CENTURA HART AP

カテゴリ
Dry / Plasma Etch
概要(Overview)

Centura HART AP is likely designed to provide high-performance, precise etching for high aspect ratio trench applications. The system may also incorporate various features to ensure process control, uniformity, and efficiency, as these are typical qualities sought in etching equipment. "High Aspect Ratio Trench" refers to a trench (or hole) in a material that is much deeper than it is wide. The aspect ratio is the ratio of the depth of the trench to its width. In the context of semiconductor manufacturing, such as the creation of DRAM (dynamic random-access memory) cells, these high aspect ratio trenches are critical. These trenches are used to store charge, with the amount of charge representing the 0s and 1s of digital data. The higher the aspect ratio, the more charge the trench can store, which can help increase the storage capacity of the memory cell.

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