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市場 > Dry / Plasma Etch > TEL / FSI > ANTARES -Nano

ANTARES -Nano

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Dry / Plasma Etch
概要(Overview)

TEL offers the new ANTARES™ – Nano which features a smaller aerosol size for improved removal efficiency in the smallest nanoparticle size range, plus improved capability for cleaning sensitive patterns without damage. Semiconductor manufacturers have advanced their technology through recent generations by introduction of various new materials, a trend which will continue for the foreseeable future. In many cases the materials have sensitivities which limit the applicability of historical wet clean processes for removing contaminants. Metals are easily corroded, hydrophobic films are prone to watermarks, and some materials such as Ge can be attacked by aqueous chemistries. Furthermore, even traditional materials such as Si and SiO2 frequently must be cleaned with near-zero material loss, due to tightened dimensional requirements. Therefore, this ANTARES™ -Nano presents cleaning methods that are safe for all materials and patterns are increasingly needed.

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