2300 EXELAN FLEX
概要(Overview)
The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
現在の掲載品
20
サービス
検査、保証、鑑定、ロジスティクス
LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 2007状態: 中古最終確認14日前LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 状態: 中古最終確認15日前LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 状態: 中古最終確認15日前LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 状態: 中古最終確認60日以上前
LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 2005状態: 中古最終確認60日以上前LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 状態: 中古最終確認60日以上前LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 状態: 中古最終確認60日以上前LAM RESEARCH CORPORATION
2300 EXELAN FLEX
Dry / Plasma Etchヴィンテージ: 2005状態: 中古最終確認60日以上前