STS provides advanced wafer processing solutions to the world's leading semiconductor and microelectronic device manufacturers. 

MULTIPLEX DRIE

The Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum load lock with STS etch plasma source to produce a platform of unrivaled quality and reliability for both R&D and pilot-production applications.

SYSTEM DESCRIPTION: Surface Technology Systems Multiplex Reactive Ion Etcher (RIE) designed for etching of 3-8 inch GaAs wafers. System can be configured with Multiplex Atmospheric Cassette System (MACS wafer handling module shown in photo; upgrade option; subject to availability). System includes: load lock, PC-controlled RIE process chamber, power distribution cabinet, RF rack, remote gas box, and chiller.

SPECIAL NOTE: Photos show the system configured with the OPTIONAL Multiplex Atmospheric Cassette System (MACS) attached. The MACS module allows for automated wafer loading (2 cassettes); it can be run in automatic mode (cassette-to-cassette) or manual mode (manual wafer load). MACS MODULE SOLD SEPARATELY.

MULTIPLEX DRIE

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MULTIPLEX DRIE

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