説明
Dielectric Etch構成
<p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>OEMモデルの説明
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 22日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
20225
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
カテゴリ
Dry / Plasma Etch
最終検証： 22日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
20225
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Dielectric Etch構成
<p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>OEMモデルの説明
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.ドキュメント
ドキュメントなし