説明
CU PLATING構成
構成なしOEMモデルの説明
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.ドキュメント
ドキュメントなし
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
検証済み
カテゴリ
PVD / Sputtering
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56159
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
検証済み
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56159
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
CU PLATING構成
構成なしOEMモデルの説明
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.ドキュメント
ドキュメントなし