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説明
説明なし構成
Cu Process SMIF Loaders - 300mmOEMモデルの説明
The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.ドキュメント
ドキュメントなし
カテゴリ
Electro Plating
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
57814
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD-312
カテゴリ
Electro Plating
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
57814
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Cu Process SMIF Loaders - 300mmOEMモデルの説明
The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.ドキュメント
ドキュメントなし