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LAM RESEARCH CORPORATION 2300 EXELAN FLEX
    説明
    説明なし
    構成
    ETCHER
    OEMモデルの説明
    The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
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    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

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    検証済み

    カテゴリ

    Etch/Asher
    最終検証: 27日前
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    100878


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2004

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    Money Back Guarantee
    Available
    Transaction Insured by Moov
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    Refurbishment Services
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    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX
    LAM RESEARCH CORPORATION2300 EXELAN FLEXEtch/Asher
    ヴィンテージ: 0状態: 中古
    最終確認26日前

    LAM RESEARCH CORPORATION

    2300 EXELAN FLEX

    verified-listing-icon

    検証済み

    カテゴリ

    Etch/Asher
    最終検証: 27日前
    listing-photo-cb1cacdf3fa54d94bce3fd03e667baea-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    100878


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2004


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    ETCHER
    OEMモデルの説明
    The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX
    LAM RESEARCH CORPORATION
    2300 EXELAN FLEX
    Etch/Asherヴィンテージ: 0状態: 中古最終検証: 26日前
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX
    LAM RESEARCH CORPORATION
    2300 EXELAN FLEX
    Etch/Asherヴィンテージ: 0状態: 中古最終検証: 26日前
    LAM RESEARCH CORPORATION 2300 EXELAN FLEX
    LAM RESEARCH CORPORATION
    2300 EXELAN FLEX
    Etch/Asherヴィンテージ: 0状態: 中古最終検証: 30日以上前