PG300RM
概要(Overview)
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.
現在の掲載品
4
サービス
検査、保証、鑑定、ロジスティクス
トップ掲載リスト
ACCRETECH / TSK
PG300RM
Lapping, Polishing, Grindingヴィンテージ: 2007状態: 中古最終確認60日以上前ACCRETECH / TSK
PG300RM
Lapping, Polishing, Grindingヴィンテージ: 2005状態: 中古最終確認2日前ACCRETECH / TSK
PG300RM
Lapping, Polishing, Grindingヴィンテージ: 状態: 中古最終確認60日以上前ACCRETECH / TSK
PG300RM
Lapping, Polishing, Grindingヴィンテージ: 2006状態: 中古最終確認60日以上前