5335

M 9850

HD 9830

The ESI 9350 is a high-performance Laser Semiconductor Processing System designed to deliver exceptional results in terms of throughput, yield, and uptime. It utilizes a patented 1.3 µm wavelength laser, which enables precise processing of metal memory link materials. This unique feature allows for higher energy levels to be used, resulting in cleaner link cuts without damaging the surrounding silicon, leading to improved yields. The Model 9350 also offers high-accuracy positioning and continuous wafer processing capabilities, ensuring precise and efficient semiconductor manufacturing.

9350

The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.

9830

M9825

HDE 9830

The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. 
Capable of processing new generations of tight pitch fuses

Designed for high volume, automated 300 mm production

Wide range of processing applications – Poly Si, Al, and Cu capable

New high-performance laser option

9820

ACCUSCRIBE TITAN

ACCUSCRIBE 2112

9275

ICP 5530

ACCUSCRIBE SS40

9850 

The 9850UV produces a 0.8-micron spot size by utilizing ESI’s new 100-kHz UV laser, which was developed specifically for advanced DRAM and NAND Flash applications.

9850UV

9835

M9830

9825

IR9850

5335xi

6100

M 4300

5320

ACCUSCRIBE 2600

8000

9835UV

M 4210

5330 FLEX

3573

5390

4571

9300

ACCULAZE SS40

4990

ICP 5330

9100

MM 5800

5330NS

5220

MF 44

ACCULAZE SS10

4573

NWR 213

 QuikLaze 50ST2 is a laser cutting solution tool designed specifically for quick, easy removal of a variety of materials. Multiple, user selectable wavelengths provide the capability to selectively remove certain materials
while leaving others unaffected.

QUICKLAZE 50ST2

4300R

5200

5530

8000C

5970

4570

4572

ACCUSCRIBE 2210

M 9275

ACCUSCRIBE 2150

 Thick film resistor trimming, thin film resistor trimming, capacitor trimming, functional or "active" trimming.

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5335

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HD 9830

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