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LD 500
カテゴリ
Laser概要（Overview）
-Green laser -Drilling, marking, structuring and ablation of free forms -Substrate thickness from 0.3mm to 50.0mm -Exactly right-angled machining -Chamfering possible during the drilling process -High yield with high accuracy -Space-saving stand-alone unit with simple user interface -integrated suction
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
