EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

Multifunctional UV Nanoimprint Lithography System


EVGroup (EVG)

EVG7300

EVG7200 LA is a large-area SmartNIL UV-NIL system up to 550 mm x 650 mm (Gen3)

EVG7200 LA-Gen3

EVG7200 LA is a semi-automated large-area SmartNIL system up to 370 x 470 mm (Gen2)

EVG7200 LA-Gen2

EVG770 is an automated NIL Stepper up to 300mm

EVG770

The EVG7200 system leverages EVG's innovative SmartNIL technology and EVG's materials expertise to enable mass manufacturing of micro- and nanoscale structures. The system brings the advanced soft stamp and imprint capability of SmartNIL to larger substrates and smaller geometries, with resolution down to 40 nm* in volume production. This enables greater cost-of-ownership (CoO) benefits and realizes the full manufacturing potential of nanoimprint lithography.

EVG7200

LITHOSCALE is a revolutionary, highly versatile maskless exposure lithography platform geared for a variety of microfabrication applications accommodating wafers up to 300 mm.

LITHOSCALE

Hercules is a lithography track system up to 300mm.
The HERCULES is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator support.

HERCULES

EVG770 NT GEN2

Hercules L is a lithography track system resist processing and expose configuration up to 300mm.

HERCULES L

Step-and-Repeat Nanoimprint Lithography System

EVG770 NT

EVG750 is an automated hot embossing system up to 200mm.

EVG750

The EVG750 roll-to-roll hot-embossing system is designed for R&D as well as pilot manufacturing of all-in-plastic flexible substrates for applications ranging from anti-counterfeiting, surface texturing (photovoltaics, displays, sensors) to biofunctional constructs. The system combines an automated foil handling unit for unwinding and rewinding with the core embossing module and accepts 300 mm wide films with thicknesses ranging from 50 µm to 1000 µm. In addition, the EVG750 roll-to-roll hot-embossing system has the ability to handle exotic films which are not available on large rolls and automatically detects the splicing film line through an optical sensor and adjusts the position of the structuring cylinder via encoders to the tape position. 

EVG750 R2R

The EVG720 system is a mass manufacturing solution that uses EVG’s SmartNIL technology to create micro and nanoscale structures. It can print nanostructures as small as 40 nm across a large area, making it an ideal tool for producing next-generation microfluidic and photonic devices, such as diffractive optical elements. The system features volume-proven imprinting technology with superior replication fidelity, integrated imprinting, UV curing demolding, and working stamp fabrication. It also offers automated cassette-to-cassette handling with a semi-automated R&D mode, optional top-side alignment and mini-environment, and is compatible with all commercially available imprint materials. The system is scalable from R&D to production and ensures process stability and reliability. The technical specifications of the EVG720 include a wafer diameter ranging from 75 to 150 mm and a resolution of up to 40 nm, depending on the template and process used.

EVGroup (EVG)

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トップEVGroup (EVG) Lithography

EVG7200 LA-Gen3

EVG7200 LA-Gen2

EVG770

EVG7300

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