ТВМ-8
カテゴリ
Metrology概要（Overview）
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
