413 C2C
カテゴリ
Metrology概要（Overview）
Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
